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Die Bonding Equipment - List of Manufacturers, Suppliers, Companies and Products | IPROS GMS

Die Bonding Equipment Product List

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ASMPT Corporation Back-end Equipment

ASMPT is a backend equipment manufacturer based in Singapore.

Kanematsu PWS has been the domestic agent for ASMPT since 2020, primarily introducing ASMPT's die bonders and various back-end equipment to domestic customers. We also provide continuous engineering support after the equipment installation. Features of ASMPT: - A wide range of back-end equipment handling, from plating solutions to dicing, die bonding, wire bonding, molding, and SMT. - Global track record of installations. - Continuous investment of 10% of total sales into equipment research and development. - Provision of engineering support both domestically and internationally. - Particularly strong lineup in die bonding equipment, offering a wide range of equipment proposals.

  • Bonding Equipment
  • Other semiconductor manufacturing equipment
  • Wafer processing/polishing equipment
  • Die Bonding Equipment

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